First, the silicon wafer mold has been volatilized before leaving the factory.
Second, the use of silicon wafer molds must be carried out in a dust-free environment.
Third, use the shovel type tweezers to take the best, to avoid the edges of the mold is dirty, affecting the appearance.
Fourth, pay attention to any operation of the silicon wafer needs to be handled gently to prevent accidental chipping.
5. Before the mold is poured into PDMS, confirm whether the surface of the mold is clean and the chip structure is intact.
6. The mold cannot be cleaned with an organic solvent.
7. If the surface of the silicon wafer is dirty, it will affect the pouring; use a dust-free cloth to draw acetone or ethanol and carefully wipe it to prevent damage; be careful not to touch the photoresist pattern.
8. When PDMS is mixed, it needs to be mixed evenly and degased before pouring.
Nine, when pouring PDMS, try to make the bottom surface of the silicon mold mold and the pouring pot better, and the horizontal center is better.
10. After the PDMS is poured, it is allowed to stand. After the bubbles in the PDMS disappear, put them into the oven to ensure the level. If there are still bubbles after standing, use the needle to carefully pick them up to avoid scratching the passage.
11. After the PDMS is completely formed, take it out, and then perform PDMS-die separation after cooling. Pay attention to the strength control and carefully peel off. When peeling off, the mold surface is kept clean and no fingerprints are left.
12. After the mold is used, put the silicon wafer mold into the wafer temporary storage box; keep it clean and not dust.
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